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FixturFab

Testing Glossary

Terminology reference for PCB testing and bed-of-nails fixtures. Clear definitions for test engineering terms, fixture components, and testing methodologies.

B

Bed-of-Nails Fixture
A test fixture that uses an array of spring-loaded probes (pins) arranged to make contact with test points on a PCB. Named for its appearance resembling a bed of nails. Used for in-circuit testing (ICT) and functional testing of assembled PCBAs.
Related:Test Fixture,Spring-Loaded Probe,Test Point
Boundary Scan
A method for testing interconnects on PCBs using the IEEE 1149.1 (JTAG) standard. Allows testing of connections between chips without physical test points, commonly used alongside bed-of-nails testing for comprehensive coverage.
Related:JTAG,ICT

C

Contact Resistance
The electrical resistance at the interface between a test probe and the test point on a PCB. Lower contact resistance improves measurement accuracy. Affected by probe force, tip condition, and surface contamination.
Related:Spring-Loaded Probe,Test Point

D

DUT
Device Under Test. The PCB assembly being tested. Also sometimes called UUT (Unit Under Test).
Related:PCBA,Test Fixture

F

First Article Inspection (FAI)
The process of verifying the first production unit of a new design meets specifications. Often includes comprehensive testing with a bed-of-nails fixture to validate manufacturing quality before full production.
Related:ICT,Test Coverage
Flying Probe
A test method using movable probes that travel to test points sequentially, rather than a fixed array of probes. Slower than bed-of-nails testing but requires no custom fixture, making it suitable for prototypes and low-volume production.
Related:Bed-of-Nails Fixture,ICT
Functional Test
Testing that verifies a PCBA operates correctly as a complete system under conditions simulating actual use. Often performed after ICT to verify the assembled product works as designed.
Related:ICT,Test Coverage

G

Guide Pin
Precision alignment pins used to ensure accurate positioning of the PCB in a test fixture. Engage with tooling holes in the PCB to achieve repeatable probe-to-pad alignment.
Related:Test Fixture,Tooling Hole

I

ICT
In-Circuit Test. A testing method that verifies individual component values and connections on a PCBA by probing test points. Detects shorts, opens, wrong components, and component failures. Typically performed using bed-of-nails fixtures.
Related:Bed-of-Nails Fixture,Test Coverage,Test Point

J

JTAG
Joint Test Action Group. Refers to the IEEE 1149.1 standard for boundary scan testing. Provides a way to test interconnects and program devices through a standard 4-5 wire interface.
Related:Boundary Scan

K

Keyed Connector
A connector designed to prevent incorrect insertion. Test fixtures often include keyed connectors to ensure proper orientation of interface cables and prevent damage.

L

Lift-Off Plate
A mechanism in a test fixture that raises the PCB off the probe field after testing, ensuring clean probe separation and preventing damage to the board or probes.
Related:Test Fixture

P

PCBA
Printed Circuit Board Assembly. A PCB with all components soldered in place, ready for testing or integration into a larger system.
Related:DUT,SMT
Probe Force
The amount of force a spring-loaded probe exerts on the test point. Higher force generally means better contact but can damage delicate pads. Typical forces range from 85g to 225g depending on probe type.
Related:Spring-Loaded Probe,Contact Resistance

S

Signal Interface
The method by which test equipment connects to a fixture. Options include pogo blocks, zero-insertion-force connectors, and various standard connectors. The interface must match the test equipment being used.
Related:Test Fixture,Pogo Block
SMT
Surface Mount Technology. A method where components are mounted directly onto the surface of a PCB rather than through holes. Most modern PCBAs use primarily SMT components, which require appropriate probe tip geometry for testing.
Related:PCBA,Test Point
Spring-Loaded Probe
A test probe with an internal spring that provides consistent contact force against a test point. Also called a pogo pin. Various tip styles are available for different pad types and sizes.
Related:Bed-of-Nails Fixture,Probe Force

T

Test Coverage
The percentage of a PCBA's components and connections that can be verified through testing. Higher coverage means more potential defects can be detected. Bed-of-nails testing can achieve high coverage when sufficient test points are available.
Related:ICT,Test Point
Test Fixture
A mechanical device that holds a PCB and provides electrical connections for testing. Bed-of-nails fixtures are the most common type for high-volume testing, providing simultaneous access to many test points.
Related:Bed-of-Nails Fixture,DUT
Test Point
A designated location on a PCB designed for probe contact during testing. Usually a bare pad or via accessible from one or both sides of the board. Proper test point placement is critical for effective ICT.
Related:ICT,Spring-Loaded Probe
Tooling Hole
A non-plated hole in a PCB used for mechanical alignment in fixtures and during manufacturing. Typically located at board corners. Test fixtures use guide pins that engage these holes for precise positioning.
Related:Guide Pin,Test Fixture

V

Vacuum Hold-Down
A method of securing a PCB in a test fixture using vacuum pressure. Provides consistent force across the board and can be quickly engaged and released. Common in high-volume production testing.
Related:Test Fixture

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